适用于每个数据分析任务的产品
Exensio Analytics Platform的设计和架构可以满足半导体生态系统中每个参与者的需求。 晶圆代工厂,IDM,OSAT和无工厂芯片供应商要在半导体市场取得成功,面临着共同而又不同的挑战。
我们与半导体生态系统中100多家领先公司合作的数十年经验为我们提供了深刻了解这些异同的洞察力。 我们已经创建了一系列产品,这些产品提供了最佳的功能组合,使每种类型的半导体公司都能显着改善推动其业务发展的关键绩效指标(KPI)。
不再有数据处理或集成问题来拖慢您的速度。 快速找到下一个制造或测试操作问题的根本原因,这些问题会影响您的产品产量、质量或上市时间。
借助Exensio Analytics Platform,您拥有业界领先的大数据平台,可以关联和分析从制造到测试,组装到现场操作的所有半导体数据。
Exensio IDM专为制造,测试,装配和封装其所有产品的公司的需求和要求量身定制。 它包括我们的所有四个核心模块: Manufacturing Analytics, Control Operations, Test Operations及 Assembly Operations
您的所有问题都能在数据上通过Exensio IDM 获得答案。
Exensio Fabless is our product for fabless semiconductor companies who design their devices but rely on OSATs for test, assembly and packaging. It includes the following three modules: Manufacturing Analytics, Test Operations及 Assembly Operations.
借助Exensio Fabless,客户可以有力地实施离群值检测,逃逸预防和自适应测试,以最大程度提高产品质量和测试效率,并成为最终客户的最佳半导体供应商。
Exensio Foundry是用于纯晶圆代工企业(Foundry)的产品,这类企业是Fabless供应链的基础,产品为他们提供了所有生产数据的单一真点(Single Point of Truth) 以及强大的可视化环境来分析其生产运营。 它包括以下两个模块: Manufacturing Analytics 和 Process Control.
With support for all leading semiconductor equipment providers and over 24,000 semiconductor manufacturing machines worldwide managed by our Process Control module within their respective foundries, PDF Solutions is the industry leader in FDC and process control.
Exensio OSAT is our product for Outsourced Semiconductor Assembly and Test companies who are the close partners for the world’s fabless semiconductor companies. The product includes the following three modules: Process Control, Test Operations及 Assembly Operations.
Exensio OSAT enables any OSAT to provide transparency and visibility to their fabless customers which is becoming more essential in the era of Industry 4.0. As more fabless companies look to implement edge intelligence into their supply chains, OSATs that implement Exensio OSAT will have a distinct advantage versus their competitors for supporting advanced edge analytics.